CMP Filtration Application Points

CMP stands for Chemical Mechanical Polishing, also known as chemical mechanical polishing, which is a key process for achieving global uniform flattening of wafers in the manufacturing process of integrated circuits.

In the CMP process, the grinding liquid, as its core material, is one of the key factors affecting the polishing quality. However, due to problems such as chemical instability and processing steps, gels and agglomerates are generally slowly formed in the grinding liquid slurry. These large particles are transported to the surface of the wafer, which easily leads to defects such as micro scratches on the surface of the wafer, resulting in significant losses in wafer yield; in addition, unlike ordinary fluid filtration, CMP slurry filtration is on the one hand to remove the large tail particles generated by agglomeration in the slurry to prevent these particles from scratching the wafer; on the other hand, it is to retain effective grinding particles to ensure a higher grinding rate and good flattening effect.

Therefore, in order to better control the particle size distribution of CMP grinding liquid particles and at the same time ensure the grinding rate, it is necessary to perform a filtration process during the production and use of slurry and match it with a suitable filter.

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